Infinity Pixel - New Generation Screens

IP MIP Series Description

The IP MIP Series is a next-generation micro LED wall featuring a 600×337.5 mm panel and P0.9 pixel pitch, delivering ultra-high color consistency, deep black levels, fine detail, and razor-sharp clarity in a true 16:9 format. Compared to traditional SMD and COB LED walls, MIP technology (Micro LED in Package) provides higher pixel density, superior color uniformity, and enhanced durability, ensuring an exceptional visual experience for both close-up and large-scale applications.

Equipped with advanced heat dissipation, full front maintenance access, multiple redundancy modes, and a wide 170° viewing angle, the U MIP Series guarantees stable, reliable performance and consistent visuals from virtually any position.

Its all-in-one, versatile design supports hanging, floor-standing, and wall-mounted installations, making it the perfect solution for immersive home theaters, high-performance command centers, corporate boardrooms, broadcast studios, and control rooms.

KEY FEATURES

01_MIP LED Packaging

MIP’s dual-encapsulated design delivers unmatched stability, uniformity, and quality—outperforming traditional SMD/COB as the premium display solution.

The MIP LED chip is a multi-layered structure designed for high-performance displays:

LED Light-emitting Chips: Each package contains individual Red, Green, and Blue Micro LED chips.

Electrode: These provide the electrical connection between the light-emitting chips and the base.

PCB: The chips and electrodes are mounted onto a Printed Circuit Board base.

Colloid and Diaphragm: The entire assembly is encapsulated in a colloid material and protected by a top diaphragm layer.
02 _Ultra-High Density , Super-Resolution

The 240×240μm chip structure enables ultra-high-density pixel integration, delivering super-resolution displays that redefine visual excellence.

MIP LED Chip (Micro LED in Package): This cross-section shows multiple, pre-packaged LED units, each containing individual "LED Light-emitting Chips" for different colors (the small red, green, and blue elements). These entire pre-packaged units are then mounted as a group onto a common base (labeled "PCB"). The packaged unit itself has internal structure, including "Electrodes," an encapsulating "Colloid," and a top "Diaphragm". This is a modular packaging approach before final mounting.

MIP Unit Structure: The 3D illustration on the left shows a single, packaged unit containing distinct red, green, and blue chip components (colors are on a yellow structure, under a clear top, within a black frame). This unit is a complete multi-color package.

MIP Display Panel: The image on the right shows an array of many of these individual MIP units mounted onto a larger display panel. The diagram highlights that a key feature is the extremely fine-pitch array, enabling very high resolution. The pixel pitch—the distance between the centers of adjacent MIP units—is explicitly measured as 0.9375mm.

The Result: The panel with this specific pixel pitch is labeled "0.9375mm MIP," highlighting the small pixel-to-pixel distance achievable with this technology.
03 _Superior Black Level & Contrast

No-substrate MIP structure improves light absorption and reduces surface reflections. Delivers deeper blacks and higher contrast, ideal for high-end indoor applications.
04 _Ultra-High Consistency

MIP’s substrate-free, flip-chip design guarantees even light emission, while advanced spectral sorting eliminates any batch differences for superior uniformity
05 _All in one Package
06 _Built For High Durability

Featuring MIP protective technology with 4H surface hardness and a 5B adhesion rating, this design delivers exceptional strength, wear resistance, and long-lasting reliability.
07 _Cool Screen

Engineered for efficiency, the U MIP Series stays cool even under long-hour operation, ensuring consistently bright, immaculate visuals.
08 _Golden Ratio 16:9

The 16:9 aspect ratio ensures the cabinet’s pixel pitch fits seamlessly with HD, 4K, and 8K resolution standards.
09 _Flexible Configuration Options

Supports multiple redundancy modes—including single-data dual-power, dual-data single-power, and full dual-data dual-power backup—to meet diverse system requirements while ensuring superior stability and reliability.
10 _Front Maintenance

Supports complete front access for quick module, PSU, and controller replacement. Front-service design simplifies maintenance in tight spaces.
11 _Ultra -Wide 170°Viewing Angle

A full 170°viewing angle provides stable brightness and color consistency, allowing audiences to see crisp details even when viewing from the side.
12 _Various Installation

Designed for full front installation and service, it removes the need for rear access and maximizes space efficiency. Supports hanging, wall-mounted, and floor-standing setups.